2018 PLENARY – The raise of photonic integration

Chip-scale integrated photonics for the mid-infrared

Delphine Marris-Morini, Qiankun Liu, Joan-Manel Ramirez, Vladyslav Vakarin, Andrea Ballabio, Daniel Chrastina, Jacopo Frigerio, Xavier Le Roux, Samuel Serna, Eric Cassan, Daniel Benedikovic, Carlos Alonso-Ramos, Laurent Vivien, Giovanni Isella
Centre de Nanosciences et de Nanotechnologies, Univ. Paris-Sud, CNRS, Université Paris-Saclay, C2N–Orsay, 91405 Orsay cedex, France:
L-NESS, Dipartimento di Fisica, Politecnico di Milano, Polo di Como, Via Anzani 42, 22100 Como, Italy

Recent works towards the development of Ge-rich SiGe photonic integrated circuits for on-chip mid-IR spectroscopy will be presented. First, the demonstration of ultra-wideband passive circuits will be discussed, followed by the first proofs of concepts towards the realization of efficient wideband
active devices. The combination of on-chip integrated spectrometers with on-chip mid-IR sources will provide a solid basis for the development of a competitive mid-IR integrated platform from 3 to 15 μm wavelength.

Keywords: silicon photonics, germanium, silicon-germanium, mid infrared

We.1.1. 8-Invited Paper, Delphine Marris-Morini (Univ. Paris-Sud), “Chip-scale integrated photonics for the mid-infrared”.

Heterogeneous large-scale photonic integration for communications and beyond

Tin Komljenovic
Department of Electrical and Computer Engineering University of California, Santa Barbara, CA 93106, USA
e-mail: tkomljenovic@ece.ucsb.edu

Heterogeneous silicon photonics using bonding is reaching maturity with first commercial products for data center market being shipped in volume. Here we give an overview of recent research in the area carried out at University of California, Santa Barbara. Ability to do multiple die bonding on a single device/die with optimized epitaxially grown layer stacks was used to realize high performing photonic integrated circuits both for communications and sensing.

Keywords: silicon photonics, heterogeneous silicon photonics, integrated optoelectronics, optoelectronic devices, semiconductor lasers.

We.1.2. 22-Invited Paper, Tin Komljenovic (UCSB), “Heterogeneous large-scale photonic integration for communications and beyond”

Solving Technical Challenges of PICs through the Advancement of Integrated Silicon Photonics Solutions for the 21st Century

Michael Liehr, Frank Tolic, Edward White, Erman Timurdogan, Benjamin Miller AIM Photonics, 257 Fuller Road, Albany, NY 12203 – USA Tel: +15189567221, e-mail: ftolic@aimphotonics.com
SUNY Polytechnic Institute, 257 Fuller Road, Albany, NY 12203 – USA Tel: +15189567221, e-mail: ftolic@sunypoly.edu
Analog Photonics, 1 Marina Park Drive, Suite 205, Boston, MA, 02210 – USA Tel: +18579911120, e-mail: erman@analogphotonics.com
University of Rochester Medical Center, 601 Elmwood Avenue, Box 697, Rochester, NY 14642- USA Tel: +15852759805, e-mail: Benjamin_Miller@URMC.Rochester.edu

In this paper, AIM Photonics describes how developing a widely accepted set of processes and protocols for the design, manufacture, and integration of silicon photonics systems not only advances this technology, but also presents a tremendous economic opportunity, with the overall global market estimated to grow to more than $795 billion by 2022. Integrated Photonics is finding use in a wide range of areas including: telecommunications, laser based radar, data communications, sensing, and many others. Integrated photonics dramatically improves the performance and reliability of electronic integrated circuits while significantly reducing size, weight, and power consumption. Integrated photonics will advance established industries and enable new ones in the 21st century in the same way that semiconductors fostered the revolution in computing, telecommunications and other fields over the past 40 years.

We.1.3. 30-Invited Paper, Michale Liehr (AIM Photonics) Silicon photonics open access in US