Conference topics cover waveguide technology and platforms, devices and materials, integrated circuits and applications of photonics integrated circuits (PICs). The most recent advances in photonic integration technologies, such as silicon photonics and III-V optoelectronics, is one of the main features of the conference. Assembly, packaging and hybrid integration techniques are also present. In addition, the conference aims to discuss novel concepts on materials with unique properties such as graphene, 2D materials or phase change materials.
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