datacom Archives - European Conference on Integrated Optics

01/05/202401/05/2024

aiXscale Photonics is exhibitor at the 2024 ECIO edition

aiXscale Photonics supplies proprietary high-precision micro-optical glass interposers for reliable, cost-effective and scalable assembly of optical transceivers and co-packaged optics. Our technology enables wafer-scale assembly of PIC connectorization with highly parallel port counts.

01/05/202401/05/2024

AIXEMTEC is sponsor of the 2024 ECIO edition

AIXEMTEC is a leading company in the field of high-precision assembly and testing technologies for photonic components. As part of the Schunk Group since January 1, 2024, AIXEMTEC benefits from a strong financial and technological foundation, enabling it to offer innovative solutions in a global context. The Schunk Group, a German foundation with a broad international presence, provides AIXEMTEC with a network of 65 locations in 26 countries.

12/02/202412/03/2024

Advances in electro-optical components for datacom and sensing applications

This presentation provides an overview of recent advances in electro-optical devices and system architectures for data communications, telecommunication transceivers, and 3D sensing applications. On the transmitter side, progress in directly modulated lasers and externally modulated lasers will be reviewed. The directly modulated lasers include gallium arsenide (GaAs) vertical cavity surface emitting lasers (VCSELs) and Indium phosphide (InP) distributed feedback lasers (DFBs).

07/02/202207/02/2022

Towards passive hybridization of high-power and high-speed InP transmitters

Is the title of the presentation by invited speaker Helene Debregeas, Director R&D, Almae Technologies, France. With a PhD in semiconductor physics, and aggregation of Mathematics), she has been an R&D engineer for many years in semiconductor optoelectronic components on InP: many years at alcatel’s research center in the III-V Lab laboratory, two years at the Bell Labs in Murray Hill in the USA, and for several years in charge of innovation at Almae Technologies, a spin-off of III-V Lab.