aiXscale Photonics supplies proprietary high-precision micro-optical glass interposers for reliable, cost-effective and scalable assembly of optical transceivers and co-packaged optics. Our technology enables wafer-scale assembly of PIC connectorization with highly parallel port counts.
Continue reading “aiXscale Photonics is exhibitor at the 2024 ECIO edition”AIXEMTEC is sponsor of the 2024 ECIO edition
AIXEMTEC is a leading company in the field of high-precision assembly and testing technologies for photonic components. As part of the Schunk Group since January 1, 2024, AIXEMTEC benefits from a strong financial and technological foundation, enabling it to offer innovative solutions in a global context. The Schunk Group, a German foundation with a broad international presence, provides AIXEMTEC with a network of 65 locations in 26 countries.
Continue reading “AIXEMTEC is sponsor of the 2024 ECIO edition”LioniX International is exhibitor and sponsor of the 2024 ECIO edition
LioniX International is a leading global provider of silicon nitride photonic integrated circuits (PICs), modules and MEMS—since 2001. Their expertise covers chip fabrication, electro-optical system architecture, and module assembly and packaging. From design to device, their vertically integrated approach supports their customers during the whole product development cycle.
Continue reading “LioniX International is exhibitor and sponsor of the 2024 ECIO edition”PHIX is sponsor of the 2024 ECIO edition
PHIX is a world leading packaging and assembly foundry for photonic integrated circuits (PICs), building optoelectronic modules based on all major PIC technology platforms (such as indium phosphide, silicon photonics, silicon nitride, and planar lightwave circuit) in scalable manufacturing volumes.
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