PHIX is sponsor of the 2024 ECIO edition

PHIX is a world leading packaging and assembly foundry for photonic integrated circuits (PICs), building optoelectronic modules based on all major PIC technology platforms (such as indium phosphide, silicon photonics, silicon nitride, and planar lightwave circuit) in scalable manufacturing volumes.

We specialize in chip-to-chip hybrid integration, coupling to fiber arrays, and interfacing of DC and RF electrical signals. By offering our knowledge already at the chip design stage, we ensure ease of scale-up for volume manufacturing and provide a one-stop-shop for PIC assembly.

Our core competencies
Going from a PIC to a functional module is a multi-disciplinary design process. It involves product design (of the chip and the module), assembly process development, and equipment management. Our engineering and management teams contain people from each of these backgrounds. This gives us the overview and maturity to optimize the product’s performance and cost while keeping the countless parameters within these disciplines in mind.

Our knowledge and experience in the fields of optics, electronics, and mechanical engineering allows us to produce working prototypes already from the first chips. We can then proceed to optimize the PIC and module design, process and equipment, in order to scale up the production of the modules to high volumes.

Combining our broad industry overview with our engineering manpower and world-wide network of suppliers, we are ready to prepare and adapt the manufacturing of your PIC-enabled modules.

We have a state-of-the-art production facility located at the High Tech Factory in Enschede, the Netherlands, supporting the global industrial development of PIC and MEMS enabled modules.

Visit the website of PHIX here to get more information.

We welcome PHIX as sponsor of the 25th ECIO edition.

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