Ultralow-capacitance opto-electronic devices towards fJ/bit photonics – Presented by Kengo Nozaki, Nippon Telegraph and Telephone Corporation

Ultralow-capacitance opto-electronic devices towards fJ/bit photonics – Presented by Kengo Nozaki, NTT Basic Research Laboratories, Nippon Telegraph and Telephone Corporation at the 19th edition European Conference on Integrated Optics, which takes place on 3 – 5 April 2017 at Eindhoven University of Technology, Blauwe Zaal in Eindhoven, The Netherlands.

The realization of ultralow-energy on-chip O-E/E-O converters is being considered one of the most demanding parts in photonics. The key in our work is the use of a photonic crystal waveguide incorporating an compact InGaAs(P) buried heterostructure, by which we can fabricate a low-capacitance photodetector and electro-absorption modulators. Ultralow-energy consumption of a femtojoule/bit level is expected by these nanophotonic devices.

About Kengo Nozaki
Kengo Nozaki received his B.E., M.E., and Ph.D. degrees in electrical engineering from Yokohama National University, Japan, in 2003, 2005, and 2007 respectively. He joined NTT Basic Research Laboratories, Nippon Telegraph and Telephone Corporation in 2008.

Read more about NTT Basic Research Laboratories, Nippon Telegraph and Telephone Corporation

About European Conference on Integrated Optics

The European Conference on Integrated Optics has now reached its 19th edition. Innovation and industry uptake is accelerating, and to capture this increasing pace, we are now transitioning to an annual event.

In 2017 we return to Eindhoven at the Science Park of the Technical University of Eindhoven. We will retain the same clear focus on leading edge research, providing a forum for experts from industry and academia to share the latest new thinking and exchange new insights and findings in the fields of integrated optics, optoelectronics and nanophotonics.

The conference scope extends from new enabling materials to the design and modelling of photonic structures, functions, devices and circuits. We also capture innovations in hybrid integration, system-on-chip and system-in-package integration. Application areas range from  optical tele- and data communications; optical interconnects, switching and storage; data and information processing, including integrated quantum circuits; and optical monitoring and sensing, including mid-IR photonics.

 

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