Fredrik Laurell, KTH Royal Institute of Technology, is member of the Steering Committee of ECIO 2017

Fredrik Laurell, KTH Royal Institute of Technology, is member of the Steering Committee of ECIO 2017 at the 19th edition European Conference on Integrated Optics, which takes place on 3 – 5 April 2017 at Eindhoven University of Technology, Blauwe Zaal in Eindhoven, The Netherlands.

About Fredrik Laurell
Laurell leads the Laser Physics group with 25 researcher at the Applied Physics Department. Their specialization is in laser physics, nonlinear optics, functional optical fibers and integrated optics.

About KTH, The Royal Institute of Technology
The Department of Applied Physics is one of the largest departments in the School of Engineering Sciences. We’re situated in AlbaNova University Center and Science for LIfe Laboratory. The research at Department of Applied Physics is primarily experimental and often multi-disciplinary. Topics range from biological and medical physics over optical physics to applied quantum physics. Prominent areas include the science and technology of bioimaging, biomolecular spectroscopy, solid-state lasers, non-linear optics, ultrasonics, x-rays, nanostructures, nanophotonics and nanoelectronics.

About European Conference on Integrated Optics
The European Conference on Integrated Optics has now reached its 19th edition. Innovation and industry uptake is accelerating, and to capture this increasing pace, we are now transitioning to an annual event.In 2017 we return to Eindhoven at the Science Park of the Technical University of Eindhoven. We will retain the same clear focus on leading edge research, providing a forum for experts from industry and academia to share the latest new thinking and exchange new insights and findings in the fields of integrated optics, optoelectronics and nanophotonics.The conference scope extends from new enabling materials to the design and modelling of photonic structures, functions, devices and circuits. We also capture innovations in hybrid integration, system-on-chip and system-in-package integration.

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