European Conference on Integrated Optics 2017 Welcomes JePPIX as Bronze Partner
JePPIX has successfully brought the European InP photonic integrated circuit (PIC) community together as a coherent force to advance and promote technology. JePPIX provides
- Open access technology. The Process Design Kit (PDK) at the heart of the multiproject wafers technology provides seamless cooperation between designers, software developers, fabs, and prototype builders and one-stop-shop brokering.
- Technology acceleration, enabling major advances in technology building blocks, leveraging know-how from multiple academic and industrial partners, across a number of joint R&D projects. JePPIX R&D focusses on InP and SiNx integration platforms and also hybrid combinations.
- Training events and technology forums enable designers to skill-up and connect with innovators and experts in the photonic integration eco-system. JePPIX connects at expos, workshops and offers training courses around the globe.
- Eco-system development is at the heart of what we do. The JePPIX Roadmap maps out the future evolution of technology, markets and the eco-system. Be a part of the next JePPIX Roadmap by completing the new technology PIC designer survey.
About European Conference on Integrated Optics (ECIO) 2017
REGISTER | PROGRAM
The European Conference on Integrated Optics has now reached its 19th edition. Innovation and industry uptake is accelerating, and to capture this increasing pace, we are now transitioning to an annual event.
In 2017 we return to Eindhoven at the Science Park of the Technical University of Eindhoven. We will retain the same clear focus on leading edge research, providing a forum for experts from industry and academia to share the latest new thinking and exchange new insights and findings in the fields of integrated optics, optoelectronics and nanophotonics.
The conference scope extends from new enabling materials to the design and modelling of photonic structures, functions, devices and circuits. We also capture innovations in hybrid integration, system-on-chip and system-in-package integration. Application areas range from optical tele- and data communications; optical interconnects, switching and storage; data and information processing, including integrated quantum circuits; and optical monitoring and sensing, including mid-IR photonics.