3DInCites is Media Partner of the European Conference on Integrated Optics

3DInCites is Media Partner of the European Conference on Integrated Optics on 3 – 5 April 2017 at Eindhoven University of Technology, Blauwe Zaal in Eindhoven, The Netherlands.

About 3DInCites

3D InCites is an online media resource founded in 2009 to stir up interest in 3D integration. Now in its 8th year, 3D InCites has broadened its scope stir up interest in heterogeneous integration. As such, 3D InCites is about much more than just through silicon vias and subsequent stacking technologies. Rather, 3D InCites has become part of the whole advanced packaging conversation as it relates to heterogeneous integration, the internet of things, and other applications these technologies enable.

As a community, 3D InCites brings to life the people, the personalities, and the minds behind heterogeneous integration and related technologies in a uniquely personal way. The goal is to inform key decision makers about progress in technology development, design, standards, infrastructure, and implementation. 3D InCites has grown to a registered membership of over 1300 with many additional visitors who stop by just to keep up with what’s happening in the world of heterogeneous integration.

About European Conference on Integrated Optics
The European Conference on Integrated Optics has now reached its 19th edition. Innovation and industry uptake is accelerating, and to capture this increasing pace, we are now transitioning to an annual event.

In 2017 we return to Eindhoven at the Science Park of the Technical University of Eindhoven. We will retain the same clear focus on leading edge research, providing a forum for experts from industry and academia to share the latest new thinking and exchange new insights and findings in the fields of integrated optics, optoelectronics and nanophotonics.

The conference scope extends from new enabling materials to the design and modelling of photonic structures, functions, devices and circuits. We also capture innovations in hybrid integration, system-on-chip and system-in-package integration. Application areas range from optical tele- and data communications; optical interconnects, switching and storage.


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