Vivien Laurent, Centre for Nanoscience and Nanotechnology, is member of the Steering Committee of ECIO 2017 at the 19th edition European Conference on Integrated Optics, which takes place on 3 – 5 April 2017 at Eindhoven University of Technology, Blauwe Zaal in Eindhoven, The Netherlands.
About Vivien Laurent
Laurent Vivien received his Ph.D. degree on the study of nonlinear optical properties of carbon nanotubes. Then, he has joined the CNRS in 2003. His activities are devoted on silicon photonics including the development of passive photonic structures, optoelectronic silicon-based devices and hybrid integration for datacom, sensing and quantum applications. In 2015, he was awarded a Consolidator Researcher Grant by the European Research Council (ERC) on strain silicon photonics
About Centre for Nanoscience and Nanotechnology
Established on June 1st 2016, the Center for Nanoscience and Nanotechnology (C2N) gathers on the same campus site the Laboratory for Photonics and Nanostructures (LPN) and the Institut d’Electronique Fondamentale (IEF). The center develops research projects in the field of material science, nanophotonics, nanoelectronics, nanobiotechnologies and microsystems, as well as in nanotechnologies. In all these fields, its research activites cover all the range from fondamental to applied science.
About European Conference on Integrated Optics
The European Conference on Integrated Optics has now reached its 19th edition. Innovation and industry uptake is accelerating, and to capture this increasing pace, we are now transitioning to an annual event.In 2017 we return to Eindhoven at the Science Park of the Technical University of Eindhoven. We will retain the same clear focus on leading edge research, providing a forum for experts from industry and academia to share the latest new thinking and exchange new insights and findings in the fields of integrated optics, optoelectronics and nanophotonics.The conference scope extends from new enabling materials to the design and modelling of photonic structures, functions, devices and circuits. We also capture innovations in hybrid integration, system-on-chip and system-in-package integration.