aiXscale Photonics is exhibitor at the 2024 ECIO edition

aiXscale Photonics supplies proprietary high-precision micro-optical glass interposers for reliable, cost-effective and scalable assembly of optical transceivers and co-packaged optics. Our technology enables wafer-scale assembly of PIC connectorization with highly parallel port counts.

Uniquely enabled by waferscale precision glass molding technology, aiXscale Photonics supplies proprietary ultra-high precision optical glass interposer solutions for reliable, low loss and cost effective assembly of transceiver optical subassemblies and co-packaged optics. We serve the needs of current and next generation high-volume Datacom and Telecom applications.

Want to make your custom Photonic Integrated Circuit (PIC) a plug & play device? We provide scalable and low cost optical interfacing to a standard MPO connector.

Customer Value
Custom Design
We adapt our proprietary glass interposer technology to your application specific needs.
aiXscale Photonics’ proprietary glass interposer technology does not require knowledge of the PIC-design. Your IP remains protected.
Scalable production
aiXscale Photonics packaging solutions build on waferscale molding and pick-and-place assembly, aimed at large volume production.

aiXscale Photonics is a spin-off of RWTH Aachen University and is backed by the Heraeus Group, and was founded in 2017 by Jeremy Witzens and Florian Merget as a spin-off from the Institute of Integrated Photonics of RWTH Aachen University, Germany.

For more information about aiXscale Photonics, visit the site.

We welcome aiXscale Photonicsas exhibitor of the 25th ECIO edition.

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