LioniX International is exhibitor and sponsor of the 2024 ECIO edition

LioniX International is a leading global provider of silicon nitride photonic integrated circuits (PICs), modules and MEMS—since 2001. Their expertise covers chip fabrication, electro-optical system architecture, and module assembly and packaging. From design to device, their vertically integrated approach supports their customers during the whole product development cycle.

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THORLABS is exhibitor at the 2024 ECIO edition

THORLABS, a vertically integrated photonics products manufacturer, was founded in 1989 to serve the laser and electro-optics research market. As that market has spawned a multitude of technical innovations, Thorlabs has extended its core competencies in an effort to play an ever-increasing role to serve the Photonics Industry at the research end, as well as the industrial, life science, medical, and defense segments.

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Nanophotonics for tailoring radiation from fast electrons

Nanophotonic methods provide intriguing options for manipulating scintillation phenomena. We will outline recent developments in this domain, along with our theoretical framework for modeling these occurrences, supported by our experimental findings. Additionally, Smith-Purcell radiation, characterized by fast electrons interacting with nano-structured materials to produce light, offers a broad spectrum of possibilities for creation of novel light sources. We will discuss our new theoretical framework designed to comprehend and tailor such phenomena, as well as our techniques for boosting Smith-Purcell radiation.

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Fraunhofer HHI is sponsor of the 2024 ECIO edition

Fraunhofer Heinrich-Hertz-Institut (HHI) in Berlin is a world leading research institution specializing in optical communication networks, photonic components, and fiber optical sensor systems.

With a focus on advancing optical technology for telecommunications, sensing, and quantum communications, HHI conducts cutting-edge research and development in areas such as fiber optics, integrated photonics, terahertz spectroscopy, and high-speed data transmission. 

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Advances in electro-optical components for datacom and sensing applications

This presentation provides an overview of recent advances in electro-optical devices and system architectures for data communications, telecommunication transceivers, and 3D sensing applications. On the transmitter side, progress in directly modulated lasers and externally modulated lasers will be reviewed. The directly modulated lasers include gallium arsenide (GaAs) vertical cavity surface emitting lasers (VCSELs) and Indium phosphide (InP) distributed feedback lasers (DFBs).

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Power-efficient silicon nitride soliton microcombs

Microcombs are strong contenders for attaining the frequency stability and performance of standard passively modelocked lasers on a chip scale. Understanding the optical phase noise dynamics in soliton microcombs and enhancing the power efficiency are crucial directions for the development of ultra-low timing jitter pulsed sources on-chip with enhanced repetition rate stability and ultra-low optical linewidth.

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Integrated devices and high-dimensional photonic systems for quantum technologies

Quantum technologies promise a change of paradigm for many fields of application, for example in communication systems, in high-performance computing and simulation of quantum systems, as well as in sensor technology. However, the experimental realization of suitable system still poses considerable challenges. Current efforts in photonic quantum target the implementation of practical and scalable systems, where the realization of controlled quantum network structures is key for many applications.

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